Semiconductor back-end process fixtures (tools) - magazines, dicing rings, and others.
With over 100 successful recruitments and expertise in 40 years, we offer customized proposals!
Our company is responsible for everything from "material procurement" to "product completion" within the UACJ Group. We provide various customers with tools used in a series of processes, from dicing for electronic components and semiconductor manufacturing to wire bonding and molding. With 40 years of stable quality in domestic production and one-stop supply, we utilize our accumulated know-how to propose solutions to our customers' challenges. [Examples of Adoption] - Cost reduction for magazines (proposal to switch from assembly-type magazines to integrated extrusion type) - Increased heat resistance in the reflow process of products (switching from resin products to aluminum products) - Lightweighting of currently used jigs (reducing weight burden on field operators) - Customizing standard products like dicing rings and ring cassettes to customer specifications - Proposing surface treatments based on application (improving wear resistance, lubrication, surface hardness, etc.)
- Company：UACJグループ 泉メタル株式会社
- Price：Other
